Eng., Sr. Electronic Packaging

Moog Inc.•Santa Barbara, CA
•$135,000 - $165,000•Onsite

About The Position

Moog Santa Barbara Operations provides advanced hardware and software solutions for ground defense platforms, with expertise in turret weapon systems, system integration, and precision motion control. From concept phase to prototype builds and field testing, we enable mission success through engineering innovation and operational excellence. With growing demand for our products in both domestic and international defense markets, Moog Santa Barbara Operations continues to expand its capabilities and workforce. Our experienced team of systems, software, mechanical, and electrical engineers collaborates to deliver innovative solutions that support the evolving needs of our customers and their missions. We are seeking a Senior Mechanical Design / Electronics Packaging Engineer to develop ruggedized electronic hardware for military ground vehicle applications. In this role you will collaborate with cross-functional teams to analyze, design, and transition electronic assemblies into production for harsh operating environments. The ideal candidate brings strong experience in mechanical design, electronics packaging, structural and thermal analysis, and development of hardware for demanding environmental conditions.

Requirements

  • Bachelor’s degree in mechanical engineering from an accredited institution
  • 5+ years of experience in mechanical design and analysis of complex systems
  • Experience with electronics packaging or mechanical design for electronic hardware
  • Proficiency with SolidWorks for 3D part and assembly modeling preferred
  • Experience with FEA tools such as ANSYS for structural and thermal analysis
  • Understanding of shock, vibration, and thermal design considerations for electronic assemblies
  • Experience working with PCBs, enclosures, connectors, and interconnects
  • Working knowledge of GD&T and engineering drawing standards
  • Familiarity with tolerance stack-up analysis
  • Ability to interpret customer requirements, specifications, and applicable industry/defense standards
  • Strong collaboration and communication skills in a cross-functional engineering environment

Responsibilities

  • Design and develop ruggedized electronics packaging for defense products used in military ground vehicle applications
  • Analyze the structural and thermal performance of electronic systems, enclosures, and assemblies
  • Create and review 3D CAD models, assembly drawings, and interface/control documentation
  • Support product development from concept through qualification and production release
  • Help define packaging approaches for shock, vibration, thermal, and environmental requirements
  • Work closely with electrical, mechanical, manufacturing, and program teams to deliver practical, manufacturable designs
  • Prepare and review engineering data related to thermal, vibration, and tolerance performance
  • Support prototype builds, testing, troubleshooting, and design refinement
  • Participate in technical reviews and help drive solutions that meet cost, schedule, and performance goals
  • Contribute as a mechanical packaging subject matter resource during proposal and development efforts

Benefits

  • annual bonuses
  • employee stock purchase plan
  • open paid time off policy
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