Sr. Director, Package Development Engineering

SiTime Corporation•Santa Clara, CA

7d•$238,950 - $341,710

About The Position

SiTime seeks a seasoned leader to drive its packaging technology and execute its innovative packaging roadmap. SiTime uses conventional and advanced wafer-scale packaging technologies to create thermally and mechanically stable environments for co-packaged MEMS. The successful candidate will bring expertise leading innovative teams, incorporating new materials, and collaborating closely with development partners. Curiosity to transcend the status quo is welcome, and silicon process technology development experience is a strong plus. The role defines packaging technology and architecture, leads collaboration with OSAT and foundry partners, oversees mechanical design and electrical-interface optimization, and advances materials characterization and laboratory workflows. It also establishes development practices and performance metrics across the package lifecycle while building and developing high-performing engineering teams. The position requires a Ph.D. or master's degree in a relevant technical discipline and 10 or more years of semiconductor packaging R&D experience, including at least five years leading teams focused on advanced heterogeneous integration. English proficiency is required. The compensation package includes base salary, eligibility for a quarterly innovation-goal bonus, and equity grants. The stated pay range is $238,950–$341,710 USD.

Requirements

Ph.D. or master's degree in Mechanical Engineering, Materials Science, Microelectronics, or Physics.
10 or more years of experience in semiconductor packaging R&D.
At least five years leading teams focused on advanced heterogeneous integration.
Expertise in semiconductor materials, process integration, process engineering, and metrology.
Ability to develop workflows using EDA tool chains and calibrate measurements to attain predictive performance.
Experience implementing automated process-control strategies for volume manufacturability and quality.
Demonstrated expertise collaborating with OSATs and semiconductor foundries, including understanding differences in supplier capabilities and establishing OSAT-specific execution frameworks.
Experience managing high-performance, geographically distributed teams with centers of excellence, local decision autonomy, and strong teamwork.
Strong cross-functional leadership, problem-solving, and communication skills.
English proficiency sufficient to communicate, collaborate, and perform responsibilities in a professional business environment.

Nice To Haves

Silicon process technology development experience.
Strategic technology leadership defining differentiated packaging visions and translating them into executable roadmaps, milestones, and measurable business outcomes.
Technical curiosity and an innovation mindset, with a drive to challenge conventional packaging approaches and solve thermal, mechanical, materials, and manufacturability problems.
Hands-on technical credibility and the ability to balance architecture, execution, quality, yield, and cost tradeoffs.
Ability to align cross-functional teams across MEMS, IC design, process technology, product engineering, operations, quality, and external partners.
Experience building and leading high-performing teams across the U.S., Taiwan, and partner locations.
Ability to build technically rigorous relationships with OSATs, foundries, equipment vendors, and materials suppliers.
Execution-oriented problem solving, including rapid issue resolution and structured root-cause analysis to reduce technical and program risk.
Customer and product impact orientation, including understanding packaging effects on system performance, reliability, manufacturability, supply resilience, and competitive differentiation.
Engineering discipline in data-driven decision-making, qualification, design for manufacturing, process control, and continuous improvement.
Talent-building and coaching skills, with a focus on ownership, collaboration, innovation, and accountability.
Entrepreneurial and resourceful approach in a fast-paced growth environment.
Ability to explain complex technical topics and influence decisions with senior leadership and external partners.

Responsibilities

Define the packaging roadmap and architecture to enable product performance, form factor, reliability, and cost; define package requirements and assembly flows aligned with quality and reliability specifications.
Lead technical relationships with OSAT partners to implement the packaging roadmap; build and manage local teams at key OSAT sites; manage issues and risk reduction across design, NPI, qualification, and volume phases; and develop yield-improvement and supply-increase plans.
Oversee mechanical design, analysis, and characterization for fit, thermal performance, structural stability, die stress, vibration immunity, and manufacturability.
Collaborate with IC design teams to optimize parasitic capacitance, resistance, and signal integrity.
Drive selection and qualification of substrates, die-attach materials, underfills, and mold compounds with suppliers.
Drive packaging-laboratory workflows to accelerate screening of alternative materials and characterization of package performance and reliability.
Define best practices and manage KPI metrics for package development and the package lifecycle.
Develop engineers and technicians and build high-performance, execution-focused teams.