Software Engineering Intern

Cadence Systems • San Jose, CA

1d

About The Position

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Responsible for designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software. Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors.

Requirements

• Currently attending a BS, MS or PhD program in ME/EE/CS.
• Strong programming skills in C++.
• Deep familiarity with object-oriented programming methods.

Nice To Haves

• Prior knowledge and experience with distributed/multi-threaded programming.
• Prior knowledge and experience with numerical analysis techniques.
• Prior knowledge and experience with meshing techniques.
• Prior knowledge and experience with finite-element based thermal simulation.
• Prior knowledge and experience with CFD analysis.
• In-depth understanding of electric cooling of PCB/package/chip.
• Experience on automatic design optimization for thermal targets.

Responsibilities

• Designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software.
• Analyzing situations or data that requires an evaluation of intangible variance factors.

What This Job Offers

• Career Level: Intern
• Education Level: No Education Listed
• Number of Employees: 5,001-10,000 employees