Software Engineering Intern

Cadence Design Systems • San Jose, CA

1d

About The Position

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. This role is responsible for designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software, and involves working on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors. Cadence is a global electronic design automation company that provides software, hardware, and intellectual property to design advanced semiconductor chips. The company is recognized by Fortune Magazine as one of the 100 Best Companies to Work For, known for its empowering culture and dedication to solving tough technical challenges. Cadence is an equal opportunity employer.

Requirements

• Attending a BS, MS or PhD program in ME/EE/CS
• Strong programming skills in C++
• Deep familiarity with object-oriented programming methods

Nice To Haves

• Prior knowledge and experience with distributed/multi-threaded programming
• Numerical analysis techniques
• Meshing techniques
• Finite-element based thermal simulation
• CFD analysis
• In-depth understanding of electric cooling of PCB/package/chip
• Experience on automatic design optimization for thermal targets

Responsibilities

• Designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software
• Working on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors

What This Job Offers

• Career Level: Intern
• Number of Employees: 5,001-10,000 employees