SI/PI Engineer

Vinci • Palo Alto, CA

16h • Hybrid

About The Position

Vinci is building Physics AI for hardware design. Its software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems by bringing AI speed and scale together with the accuracy and determinism of traditional simulation. The product supports the design, verification, manufacture, and integration of advanced semiconductors and complex systems.

As part of the Forward Deployment Sales team, the SI/PI Engineer helps prospective customers understand and adopt Vinci’s software. The role applies power architecture, electromagnetics, and transmission line theory to build and simulate models using real customer designs, validate the software, and demonstrate its value in production workflows. Work includes SI/PI analysis of high-speed interfaces such as HBM, DDR/LPDDR, PCIe, SerDes, and UCIe, as well as power delivery networks across the chip-package-PCB stack.

The engineer works directly with customer engineering teams, providing demonstrations, technical deep-dives, training, and deployment support. Insights from customer engagements are shared with Product and Engineering to help identify product needs and shape the roadmap. This is a hybrid role requiring three days per week in the Palo Alto office, with moderate travel primarily in the United States and infrequent international travel to customers and events in Asia and Europe.

Requirements

• Degree in Electrical Engineering or a related field, with a strong academic background in electromagnetic theory and transmission lines.
• 5–10+ years of hands-on SI/PI analysis for high-speed interconnects in chip/package or system PCB design.
• Experience with industry SI/PI modeling toolchains such as Ansys HFSS, SIwave, or Q2D; Keysight ADS; Cadence Sigrity; SPICE/Spectre; or similar tools.
• Working knowledge of SI fundamentals for high-speed SerDes and parallel interfaces, and PI fundamentals including PDN impedance, decoupling, IR drop, and noise.
• Scripting skills in Python, MATLAB, or Perl.
• Experience in a customer-facing engineering role.
• Strong problem-solving instincts and a record of quickly learning new tools and workflows.
• Ability to explain complex technical results clearly to engineering and business audiences.

Nice To Haves

• Experience with 2.5D/3D heterogeneous packaging and HBM/DRAM SI/PI for AI accelerator or HPC silicon.
• Experience driving SI/PI requirements from architecture definition through post-silicon validation.
• Background in pre-sales or technical sales for EDA or simulation software.
• Comfort with AI-assisted design tools and emerging physics-based workflows.

Responsibilities

• Engage with customer package and PCB design engineers during evaluations; set up simulations, run test cases, and translate SI/PI results into layout optimization recommendations.
• Assess system-level SI/PI performance and correlate Vinci results with industry-standard EM and circuit simulation tools.
• Work with the sales team on product demonstrations, proof-of-concept evaluations, and technical deep-dives with prospective customers.
• Support customer onboarding and deployment with technical guidance, training, and troubleshooting through production use.
• Identify customer pain points in SI/PI workflows and work with Product and Engineering to improve product capabilities.
• Deliver training sessions and workshops to help customer teams adopt and scale Vinci in their design flows.
• Represent Vinci at industry conferences and semiconductor events through live demonstrations and technical engagement with prospects and partners.
• Track industry trends, emerging technologies, SI/PI design best practices, and competing tools, and explain Vinci’s differentiators.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level