Senior Scientist, Advanced Packaging

Qnity•Marlborough, MA

9d•$99,120 - $155,760•Onsite

About The Position

Qnity is seeking a highly motivated, innovative, hands-on Senior R&D Scientist to lead development of next-generation copper electroplating solutions for dual damascene interconnect applications. The role focuses on designing, formulating, and scaling advanced copper plating chemistries and processes to support future semiconductor technology nodes, with improved feature-filling performance, reliability, and manufacturing productivity. The successful candidate will work at the intersection of electrochemistry, materials science, semiconductor process integration, and customer collaboration to develop products for leading-edge memory manufacturers. Success requires strong experimental skills, effective cross-functional collaboration, and creative problem-solving in situations where established solutions may not exist.

Requirements

Ph.D. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or a related technical discipline.
Strong understanding of electrochemistry and metal electrodeposition principles.
Experience designing and analyzing statistically driven experiments.
Proven record of technical innovation and problem solving.
Excellent communication and presentation skills.
Ability to work effectively in a multidisciplinary and customer-facing environment.

Nice To Haves

Direct experience with electroplating for semiconductor applications.
Knowledge of dual damascene integration and BEOL metallization processes.
Familiarity with electrochemical methods including cyclic voltammetry, EIS, chronoamperometry, and chronopotentiometry at a rotating disk electrode.
Understanding of reliability challenges including electromigration, stress migration, and void formation.
Experience transferring R&D technologies into manufacturing environments.
Track record of patents, technical publications, and customer-facing technology development.

Responsibilities

Lead research and development of advanced copper electroplating chemistries for dual damascene semiconductor interconnect fabrication.
Design and execute experiments to optimize copper fill performance in high-aspect-ratio trenches and vias.
Partner with the Material Innovation team to develop novel additive systems, including suppressors, accelerators, levelers, and related formulation components.
Investigate plating mechanisms using electrochemical, analytical, and materials characterization techniques.
Collaborate with process integration, analytical, engineering, and manufacturing teams to accelerate technology development.
Support scale-up from laboratory development through pilot manufacturing and customer qualification.
Work directly with leading semiconductor customers to understand technology challenges and translate requirements into product roadmaps.
Drive technical programs in collaboration with global teams, including scientists and engineers, customer-facing account teams, and external partners.
Drive intellectual property generation through invention disclosures, patents, and technical publications.
Present technical results to customers, senior management, and industry conferences.
Monitor industry trends in advanced semiconductor metallization, interconnect scaling, and next-generation packaging technologies.