Senior Quantum Engineer, Hybrid Interconnect

Applied Materials•Santa Clara, CA

24d•$138,000 - $190,000•Hybrid

About The Position

Applied Materials’ CTO group develops enabling technologies for quantum information applications, including superconducting qubits and optical quantum computing. The group collaborates with system companies and universities to develop quantum devices with lower error rates, drawing on materials engineering and semiconductor processing to improve device performance. The Senior Quantum Engineer, Hybrid Interconnect will develop technologies that scale quantum systems through modular and heterogeneous interconnects. The role focuses on novel devices, materials, and integration technologies for coherent quantum interconnects, using advanced semiconductor fabrication to bridge quantum modalities and enable scalable architectures. Relevant areas include quantum transduction, single-photon detection, quantum memory, and solid-state qubit interfaces to optical or microwave photons. Device design, fabrication, and characterization experience is desirable. The position is based in Santa Clara, California, is hybrid, and involves travel approximately 10% of the time. Relocation is eligible. The role may lead functional teams or projects with moderate resource requirements, risk, or complexity, and works across quantum physics, photonics, superconducting devices, materials, process engineering, packaging, and system engineering.

Requirements

Strong background in quantum devices and interfaces.
Expertise in one or more of the following areas: quantum transduction, single-photon detection, quantum memory, or solid-state qubit interfaces to optical or microwave photons.

Nice To Haves

Experience in device design, fabrication, and characterization.

Responsibilities

Pathfind and develop hybrid quantum interconnect technologies for scalable and modular quantum systems.
Design and develop devices for quantum transduction, single-photon detection, quantum memory, and solid-state qubit-to-photon interfaces.
Translate quantum-system and interconnect requirements into device, materials, fabrication, and integration specifications.
Design and characterize hybrid quantum devices and test structures, connecting device-level performance with system-level requirements.
Develop and optimize fabrication and integration processes involving superconducting, photonic, semiconductor, and other quantum materials and devices.
Investigate heterogeneous integration approaches that combine multiple quantum device technologies within scalable architectures.
Design experiments and perform electrical, optical, microwave, and cryogenic characterization, as appropriate for the device platform.
Analyze device performance and identify relationships among materials, interfaces, fabrication processes, and quantum performance.
Troubleshoot complex device and integration challenges and drive improvements in performance, reproducibility, and scalability.
Collaborate across quantum physics, photonics, superconducting devices, materials, process engineering, packaging, and system engineering.
Evaluate emerging quantum interconnect technologies and identify opportunities where advanced semiconductor manufacturing can enable system-level scaling.