Senior Power and Thermal Architect

NVIDIA•Santa Clara, CA

6d•Hybrid

About The Position

NVIDIA’s Silicon Co-Design Group is hiring a Senior Architect to identify emerging system-level power and thermal co-design ideas and drive them across teams into product differentiation across NVIDIA’s roadmap. The role shapes system, platform, and datacenter features and behavior, collaborating across architecture, design, software, operations, platforms, and productization. The architect will evaluate research and industry developments, build product-differentiation cases, and lead selected concepts from initial idea through production. Areas of innovation include workload-aware power and thermal controls, closed-loop platform telemetry, datacenter-class power compliance, platform-scale energy buffering, advanced cooling, and emerging memory co-design. The role also maintains an intercept pipeline and briefs leadership on candidate technologies and their productization status.

Requirements

Bachelor’s, master’s, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience.
12 or more years of experience in system-level power, thermal, or related architecture.
Deep expertise in at least one of: system power management, system thermal architecture, platform energy architecture, workload-aware power and thermal controls, or memory co-design.
External technical recognition, premier publications, patents, or industry standards contributions.
Track record of taking research-grade ideas through system co-design and into measurable product impact.
Demonstrated ability to influence and align cross-functional teams without direct reporting authority.
Excellent problem-solving, partnership, and social skills.

Nice To Haves

PhD or equivalent experience with sustained research contributions after entering industry.
Experience applying machine learning or data-driven techniques to system power, thermal modeling, or design-space exploration.
Background in system reliability and variability, usage-pattern-based aging management, RAS, lifecycle management, and their intersection with power and thermal.
Hands-on familiarity with emerging memory technologies, including advanced HBM and stacked memory.
Active contributions to standards bodies, consortia, or external technical communities.

Responsibilities

Architect next-generation system-, platform-, and datacenter-level power and thermal co-design solutions.
Survey internal research, academia, standards bodies, and silicon, memory, packaging, and platform partners for emerging technologies and ideas.
Assess candidate ideas for performance, power, reliability, schedule, and cost, and develop the case for product differentiation.
Lead co-design from concept through productization, aligning architecture, VLSI, software, platform, packaging, and operations teams.
Shape innovation in workload-aware power and thermal controls, closed-loop platform telemetry, datacenter-class power compliance, platform-scale energy buffering, advanced cooling, and memory co-design.
Maintain a pipeline tracking candidate technologies, productization status, decision gates, and product axes.
Brief Silicon Co-Design Group and broader NVIDIA leadership on emerging opportunities.
Collaborate with system architects, platform and software engineers, manufacturing partners, and external researchers to bring products to market.