Senior Power and Thermal Architect

NVIDIA•Santa Clara, CA

About The Position

NVIDIA’s Silicon Co-Design Group is hiring a Senior Architect to identify emerging system-level power and thermal co-design ideas and drive them across teams into product differentiation. The role shapes system, platform, and datacenter features and behaviors across NVIDIA’s roadmap, working across architecture, design, software, operations, platforms, and productization. The architect will evaluate research and industry developments, build product cases for candidate ideas, and lead selected co-design concepts from inception through production. Areas of focus include workload-aware power and thermal controls, closed-loop platform telemetry, datacenter-class power compliance, platform-scale energy buffering, advanced cooling, and emerging memory co-design. The role also maintains an intercept pipeline and briefs NVIDIA leadership on the status and prospects of new technologies.

Requirements

BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience.
12+ years in system-level power, thermal, or related architecture.
Deep expertise in at least one of the following: system power management, system thermal architecture, platform energy architecture, workload-aware power and thermal controls, or memory co-design.
External technical recognition, premier publications, patents, or industry standards contributions.
Track record of taking research-grade ideas through system co-design and into measurable product impact.
Demonstrated ability to influence across functions and align teams without direct reporting authority.
Excellent problem-solving, partnership, and social skills.

Nice To Haves

PhD or equivalent experience with sustained research contributions after entering industry.
Machine learning or data-driven techniques applied to system power, thermal modeling, or design-space exploration.
Background in system reliability and variability, usage-pattern-based aging management, RAS, lifecycle management, and their intersection with power and thermal.
Hands-on familiarity with emerging memory technologies, including advanced HBM and stacked memory.
Active contributions to standards bodies, consortia, or external technical communities.

Responsibilities

Architect next-generation system-, platform-, and datacenter-level power and thermal co-design solutions.
Scan internal research, academia, standards bodies, and silicon, memory, packaging, and platform partners for emerging technologies and ideas.
Build product differentiation cases for candidate ideas, considering performance, power, reliability, schedule, and cost.
Lead end-to-end co-design from concept to product.
Align architecture, VLSI, software, platform, packaging, and operations teams to bring selected technologies into production.
Shape innovation in workload-aware power and thermal controls, closed-loop platform telemetry, datacenter-class power compliance, platform-scale energy buffering, advanced cooling intercepts, and emerging memory co-design.
Maintain an intercept pipeline tracking candidates, productization status, decision gates, and product axes.
Brief SCG and broader NVIDIA leadership on emerging opportunities.
Collaborate with system architects, platform and software engineers, manufacturing partners, and external researchers to bring next-generation products to market.