Semiconductor Advanced Packaging Process Engineering Intern

Keysight Technologies, Inc. • Santa Rosa, CA

10h • Onsite

About The Position

This internship is a minimum of 3 months but can be extended up to a year depending on the project and candidates availability. As a Semiconductor Advanced Packaging Process Engineering Intern within the Keysight Labs/High Frequency Technology Center, you will contribute to the development and optimization of next-generation heterogeneous integration and advanced packaging technologies. Working alongside process and manufacturing engineers, you will support the development, characterization, and continuous improvement of semiconductor assembly processes used to manufacture advanced System-in-Package (SiP) products and interposer technologies. This internship is highly hands-on and provides extensive opportunities to work directly with manufacturing equipment, engineering experiments, process characterization, and data analysis in a fast-paced R&D environment. Successful candidates are naturally curious, eager to learn, comfortable working in a laboratory or manufacturing setting, and willing to ask questions to accelerate their understanding and impact.

Requirements

• Graduate student pursuing an M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, Manufacturing Engineering, or a related technical field.
• Academic or research experience in semiconductor processing, materials characterization, microfabrication, device fabrication, advanced packaging, manufacturing engineering, or related areas.
• Understanding of semiconductor manufacturing processes, materials, and device fundamentals.
• Strong analytical, problem-solving, and data interpretation skills.
• Excellent written and verbal communication skills and the ability to work effectively in a collaborative team environment.
• Self-motivated with a demonstrated ability to manage multiple tasks and meet project objectives in a fast-paced R&D environment.
• Demonstrated hands-on laboratory, manufacturing, research, or engineering project experience.
• Strong curiosity, willingness to learn, and a proactive approach to asking questions and seeking feedback.
• Candidates who wish to be considered must be enrolled in an accredited college/university as of September 2027. Applicants who have graduated before September 2027 will not be considered unless they are entering/applying to a MS or PHD program after graduating.
• This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export-controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export-controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3).

Nice To Haves

• Hands-on laboratory or research experience with semiconductor fabrication processes such as lithography, deposition, etch, electroplating, CMP, metrology, defect inspection, advanced packaging, or semiconductor assembly technologies.
• Experience with statistical analysis, design of experiments (DOE), process characterization, or data analysis tools such as JMP, MATLAB, Python, or equivalent.
• Experience with manufacturing equipment, automation, robotics, precision motion systems, or machine vision systems.
• Experience presenting technical results through reports, publications, conference presentations, or research reviews.
• Experience working in cleanroom, laboratory, or manufacturing environments.
• Exposure to advanced packaging, flip-chip assembly, thermocompression bonding, or electronic packaging technologies is highly desirable.

Responsibilities

• Assist with the planning, execution, and documentation of engineering experiments to evaluate process, material, and equipment performance.
• Collect, analyze, and interpret process, metrology, and electrical test data to identify trends and improvement opportunities.
• Work directly with advanced semiconductor assembly equipment, including thermocompression bonding (TCB), pick-and-place, inspection, and supporting process tools.
• Support process development activities focused on improving assembly cycle time, throughput, yield, and process robustness.
• Execute hands-on equipment experiments, collect process data, and partner with engineers to identify and implement process improvements.
• Assist in failure analysis, defect characterization, and troubleshooting of assembly-related process issues.
• Develop and maintain technical documentation, including experiment plans, procedures, reports, and presentations.
• Present technical findings and recommendations to engineering teams and project stakeholders.
• Follow established safety, quality, and cleanroom operating procedures while working in a semiconductor manufacturing environment.

Benefits

• Visa Sponsorship is not available for this position. Candidates who now or at any point in the future require sponsorship for employment visa status (e.g., H-1B Visa status) may not be considered.

What This Job Offers

• Career Level: Intern