Senior Advanced Semiconductor Packaging Engineer - 1119

Quantinuum • US Malta, NY

3d

About The Position

Quantinuum is seeking a Senior Advanced Semiconductor Packaging Engineer to develop innovative and reliable packaging schemes for highly scaled ion traps used in its quantum computers. The role may be based at one of the company’s Minneapolis, Minnesota sites or at a supplier site in Malta, New York, and is a full-time Quantinuum position. The engineer will collaborate with ASIC designers, ion trap designers and fabricators, optical designers, and third-party vendors to prototype, design, and fabricate ion trap assemblies. The work takes place in a fast-paced, multifunctional, team-based technical environment.

Applicants for placement in safety-sensitive positions must submit to a pre-employment drug test. Due to contractual requirements, candidates must be a U.S. person, defined in the posting as a U.S. citizen, permanent resident or green card holder, or a person granted asylum or refugee status.

The annual base pay range is $147,000–$197,000. Actual compensation may vary based on skills, education, professional experience, and other qualifications. Quantinuum describes itself as a full-stack quantum computing company with more than 800 employees and operations in the United States, United Kingdom, Germany, Japan, and Singapore.

Requirements

• Bachelor’s degree minimum.
• At least 5 years of experience in an engineering or R&D environment.
• At least 3 years of experience in advanced semiconductor packaging development.
• Must be a U.S. person, as defined in the posting: a U.S. citizen, permanent resident or green card holder, or a person granted asylum or refugee status.

Nice To Haves

• PhD in Physics or Engineering.
• 7 years of experience with advanced large-area multi-chip semiconductor packaging technologies.
• 5 years of experience with large heterogeneous integration and 2.5D–3D packaging techniques.
• 5 years of experience with high-density I/O technologies.
• Experience with photonic packaging and fiber-to-chip coupling.
• A proven track record of innovation and IP development.
• Experience working within a cross-functional team environment.

Responsibilities

• Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces to next-generation ion traps.
• Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density.
• Work with vendors to implement and validate packaging processes.
• Support all stages of ion trap development to ensure compatibility with packaging.
• Work with the broader Quantinuum team to ensure ion trap packaging meets system requirements.
• Engage with third parties to cultivate potential key partnerships, supplier relationships, and co-development opportunities.

Benefits

• Competitive compensation.
• Flexible work arrangements.
• Employer-subsidized medical, dental, and vision insurance.
• 401(k) retirement savings plan with company match.
• Student loan repayment benefit.
• Equity opportunities.
• Generous paid time off and sick leave.
• 12 paid holidays annually.
• Paid parental leave.
• Employee discount programs.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior