Recent Graduate-Process Engineer – Advanced Semiconductor Packaging

Keysight Technologies, Inc.•Santa Rosa, CA

4d•Onsite

About The Position

Keysight’s High Frequency Technology Center (HFTC) is seeking a recent graduate to develop next-generation advanced packaging technologies and products. The Process Engineer will lead development of System in Package (SiP) modules integrated with microwave and mmWave subsystems across Keysight. The role focuses on process research and development, process integration, and New Product Introduction, with work spanning process definition, optimization, yield improvement, and transfer to manufacturing. The position is onsite at Keysight Headquarters in Santa Rosa, California, and involves working inside a cleanroom for several hours each day, with time split between the cleanroom and office. Depending on the candidate’s expertise, work may focus on die attach, flip-chip and thermocompression bonding, surface cleaning and preparation, adhesive dispense and pick-and-place, SMT, die singulation and sorting, or metrology. The role collaborates with design, process, integration, product, equipment, manufacturing, operations, and customer teams to deliver new SiP products and support production.

Requirements

M.S. or Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering, Manufacturing Engineering, Mechatronics, or a relevant field, with applicable experience, training, and interest in semiconductor fabrication processes; B.S. graduates with relevant experimental research experience will also be considered.
Must be a recent graduate in 2026 or have completed the degree by June 2027.
Must be local to or willing to relocate to Santa Rosa, California.
Expertise, academic training, or internship experience in one or more of the following: cleanroom, microelectronics, or related experimental research; process development and data-driven process optimization; or problem-solving and analytical skills for controlling process variation.
Excellent interpersonal, verbal, written, and presentation communication skills, including the ability to explain complex technical information clearly, present data effectively, and collaborate across cross-functional teams.
Strong accountability, self-initiative, and a proactive attitude.
Must be comfortable working inside a cleanroom for several hours each day, handling real products, and flexing time between cleanroom and office work.
Must be a U.S. citizen, lawful permanent resident, protected individual, or otherwise authorized by the U.S. government to access export-controlled items.

Nice To Haves

Industrial semiconductor, advanced packaging, or heterogeneous integration experience.
Familiarity with programming and operating automatic assembly equipment.
Knowledge of and experience forming metallurgical bonds between similar metals.
Experience with adhesives, underfill materials, and dispense processes.
Experience with wafer singulation processes.
Experience with thermal, mechanical, and electrical reliability.
Project lifecycle experience.
Experience with III-V compound semiconductors and/or silicon technologies.
Broader experience in upstream and downstream processes and an ability to understand process interactions.

Responsibilities

Drive process control and stability through statistical process control, root-cause analysis, corrective actions, and statistical tools such as JMP.
Work with process, integration, product, and SiP design engineers to define process and performance targets.
Define process flows, develop new processes, and lead continuous process improvement to maximize product yield.
Develop and maintain high yields; report process metrics, root-cause investigations, and process change implementations at the department level.
Ensure successful process handoff to manufacturing partners.
Work with Operations to implement robust process control, support production processes, and promptly diagnose and resolve process problems.
Lead capital equipment acquisition projects, including tool evaluation, characterization, process development, and qualification.
Propose Design of Experiments (DOE) plans, conduct experiments, and implement process changes in a controlled manner.
Collaborate with equipment engineering on tool performance optimization, preventive maintenance strategies, and throughput improvements.
Lead technical development of new SiP introductions with upstream design, process, manufacturing, and downstream customer teams.
Meet accelerated project schedules and communicate and manage risks.
Review new designs for manufacturability and provide feedback to module designers.
Depending on expertise, work in areas including die attach (flip-chip and thermocompression bonding), surface cleaning and preparation, automatic adhesive dispense and pick-and-place, SMT, automatic die singulation and sorting, or metrology.