Micron Technology’s Wafer Level Packaging Technologies Team develops advanced interconnect and packaging solutions for next-generation memory technologies. Based in Boise, Idaho, the team collaborates across engineering fields to define technology requirements, build program plans, and advance process integration. As an Advanced Package TD Process Integration Intern, you will work alongside experienced engineers to support the development of sophisticated interconnect technologies. The internship provides hands-on experience in problem-solving, experimental design, line monitoring, and data analysis, with contributions to yield improvement and process optimization. The role also involves using AI tools, workflows, and agents to maximize learning.
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Career Level
Intern