Micron Technology’s Wafer Level Packaging Technologies Team develops advanced interconnect and packaging solutions for next-generation memory technologies. Based in Boise, Idaho, the team works across engineering disciplines to define technology requirements, build program plans, and advance process integration. As an Advanced Package TD Process Integration Intern, you will work with experienced engineers to support development of sophisticated interconnect technologies. The internship provides hands-on experience in problem-solving, experimental design, line monitoring, and data analysis, contributing to yield improvement and process optimization. The role also involves using AI tools, workflows, and agents to maximize learning.
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Job Type
Full-time
Career Level
Intern