At AMD, the mission is to build products that accelerate next-generation computing experiences across AI, data centers, PCs, gaming, and embedded systems. The company fosters a culture of innovation, collaboration, and shared passion to create extraordinary technology, emphasizing bold ideas, human ingenuity, and diverse perspectives. This role offers an opportunity to work on cutting-edge next-generation technologies for future AMD Microprocessors, Graphics Cards, and VR sets. The position is within the rapidly growing field of Chiplet Interconnect technology, supporting both AMD proprietary I/O protocols and driving industry standards like Universal Chiplet Interconnect Express (UCIe) and Ultra Accelerator Link (UALink). The IP portfolio focuses on short/ultra-short reach die-2-die interconnects with various bounding box requirements. As a member of this team, the engineer will be involved in IP development, design-specification, digital design, and collaboration across areas including DFT, Firmware, Design verification, and Physical Design.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees