RF Electromagnetic (EM) Engineer - San Diego

Qualcomm•San Diego, CA
•$154,000 - $231,000•Onsite

About The Position

Qualcomm is the industry leader in 4G, 5G, and future-generation communication technology and designs the most advanced radio technology in the commercial wireless marketplace. QCT's RF EM Team is actively seeking engineers with demonstrated experience in the design, EM simulation and circuit modeling of passive RF components for use in our RFIC designs.

Requirements

  • Bachelor's degree in Science, Engineering, or related field.
  • 4+ years RF and electromagnetic design, verification, or related work experience.
  • Minimum Qualifications: Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
  • OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
  • OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
  • Required: Bachelor's degree in Science, Engineering, or related field.

Nice To Haves

  • Experience in the design and simulation of RF passive components such as inductors, transformers, MOM capacitors and passive filters.
  • Demonstrated abilities with EM simulation techniques and tool including EM solvers (EMX, Helic, Peakview, HFSS, Clarity, etc).
  • Experience with circuit design and layout using Cadence tools and Keysight ADS.
  • Compact RLCK Model extraction of multiport passive components.
  • Ability to use EM tools to predict circuit level electric and magnetic coupling.
  • Passionate self-starter and team player with experience in project leadership and multi-tasking.
  • Preferred: Master's and PhD

Responsibilities

  • Design and develop RF passive components for use in the next generation of highly integrated RF integrated circuits in deep sub-micron CMOS and SOI technologies.
  • Work with the circuit design team to optimize component sizes and performance for use in RF circuit blocks.
  • Deliver components that include compact models, and DRC clean physical designs.
  • Execute isolation analysis and optimization to reduce on-chip and chip-package-PCB coupling.
  • Optimization of multichip carriers for RF systems, focusing on loss and isolation.

Benefits

  • competitive annual discretionary bonus program
  • opportunity for annual RSU grants
  • highly competitive benefits package
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