Quantum Packaging Thermal Architect

Intel Corporation•Hillsboro, OR

1d•$141,910 - $200,340•Onsite

About The Position

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Requirements

Excellent communication and presentation skills for technical and non-technical audiences
Strong analytical thinking and problem-solving capabilities
Collaborative mindset with ability to work effectively across diverse teams
Adaptability to work in a fast-paced, innovative research environment
Passion for pushing the boundaries of quantum technology development
M.S. degree in Electrical Engineering, Physics or related field AND 5+ years of experience in in Thermal modeling and simulation for packaging, or other related hardware.
OR Ph.D. degree in Electrical Engineering, Physics or related field with academic or work experience in the related areas.
Experience with thermal/mechanical modeling, simulation, and optimization with simulation software such as Ansys Icepak, COMSOL, and related.
Understanding of packaging technologies and thermal integration.

Nice To Haves

2+ years of experience with thermal/mechanical cryogenic packaging modeling and simulation.

Responsibilities

Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware
Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders
Work closely with mechanical designers to define heat spreaders for optimal performance
Deliver and disseminate design milestones to stakeholders
Communicate designs in presentations and relevant documentation
Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers