Product Pathfinding Engineer- HIG-TPG

Micron Technology•Boise, ID

About The Position

Micron Technology is seeking a Product Pathfinding Engineer for its High Bandwidth Memory (HBM) technology team. The role develops JEDEC-HBM or alternative Near Memory DRAM solutions and implements innovative 2.5D and 3D solutions, including HBM, from electrical and packaging perspectives. Product Engineers serve as a key interface among Research and Development, Manufacturing, Marketing, and Quality Assurance, supporting Micron's goal of producing DRAM efficiently. Within the HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), the team innovates and integrates front-end and backend processes, develops solutions, debugs tests, and applies qualification techniques. The group aims to build low-power-per-bit solutions that improve customer experience in machine learning and artificial intelligence.

Requirements

Strong foundation in Electrical or Computer Engineering with proven industry experience in high-speed datapath design, logic development, and advanced circuit analysis.
Ability to solve complex technical challenges using analytical, debugging, and problem-solving skills.
Track record of delivering high-quality results and driving excellence in areas of responsibility.
Success collaborating across multifunctional teams to solve complex problems and achieve shared business objectives.
Excellent communication, presentation, and interpersonal skills, including the ability to influence partners and work in a collaborative environment.

Nice To Haves

Technical leadership ability to guide projects, influence decisions, and drive successful outcomes across engineering teams.
Familiarity with DRAM architecture, design, and related semiconductor technologies.
Understanding of how product yield, quality, and manufacturing efficiency affect business performance and revenue.
Experience collaborating with multifunctional teams across geographic locations and engineering subject areas.
Ability to thrive in a global, fast-paced environment while balancing technical excellence, teamwork, and business objectives.

Responsibilities

Collaborate with customers, TD, Test, and Manufacturing to capture key requirements and findings for next-generation product development.
Work with System Engineering, Component Validation, and Media Health teams to plan responses to future technology-node changes and ensure adequate test coverage for the upcoming Alpha product.
Ensure silicon findings are resolved within encouraged issue-closure timelines for assigned designs.
Build alliances with Build, Verification, Product Architecture, System Compatibility Group, and Silicon Strategy teams to deliver products effectively and efficiently.
Identify and coordinate ongoing build-readiness improvement initiatives to implement lessons learned quickly.
Work with the Product Leadership Team to incorporate build readiness into overall product strategy and align strategies with product objectives and timelines.