Micron Technology is seeking a Principal Mixed Signal Design Engineer to define and own mixed-signal architecture for critical HBM and DRAM subsystems. The role covers high-speed I/O and PHY circuits; clocking, PLL/DLL, and timing distribution; data-path analog front ends; and voltage regulation, sensing, and reference generation. The engineer will drive architectural tradeoffs across performance, bandwidth, latency, power, area, reliability, and scalability across HBM and DRAM product families, while ensuring robust reset and power-up behavior, corner-case handling, and clean ECO pathways. The engineer will lead advanced mixed-signal and analog circuit design, pre-silicon validation strategy, and post-silicon bring-up, characterization, and debug. The role ensures compliance with HBM/DRAM specifications and requirements for reliability, aging, functional safety, EM/IR, noise, and variation tolerance. It also guides mixed-signal verification strategy and partners with digital design and verification, physical design and layout, packaging, SI/PI, and process technology teams. The role includes mentoring senior and staff-level engineers, evolving design methodologies and best practices, and applying AI/ML-assisted and data-driven methods to improve analysis, simulation efficiency, failure triage, optimization, debug, and engineering workflows. The position collaborates with cross-functional teams to evaluate and integrate AI-enabled tools that improve productivity, design quality, verification coverage, and time-to-market.
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Job Type
Full-time
Career Level
Principal
Education Level
No Education Listed