Principal Mixed Signal Design Engineer

Micron Technology•Richardson, TX

About The Position

Micron Technology is seeking a Principal Mixed Signal Design Engineer to define and own mixed-signal architecture for critical HBM and DRAM subsystems. The role covers high-speed I/O and PHY circuits; clocking, PLL/DLL, and timing distribution; data-path analog front ends; and voltage regulation, sensing, and reference generation. The engineer will drive architectural tradeoffs across performance, bandwidth, latency, power, area, reliability, and scalability across HBM and DRAM product families, while ensuring robust reset and power-up behavior, corner-case handling, and clean ECO pathways. The engineer will lead advanced mixed-signal and analog circuit design, pre-silicon validation strategy, and post-silicon bring-up, characterization, and debug. The role ensures compliance with HBM/DRAM specifications and requirements for reliability, aging, functional safety, EM/IR, noise, and variation tolerance. It also guides mixed-signal verification strategy and partners with digital design and verification, physical design and layout, packaging, SI/PI, and process technology teams. The role includes mentoring senior and staff-level engineers, evolving design methodologies and best practices, and applying AI/ML-assisted and data-driven methods to improve analysis, simulation efficiency, failure triage, optimization, debug, and engineering workflows. The position collaborates with cross-functional teams to evaluate and integrate AI-enabled tools that improve productivity, design quality, verification coverage, and time-to-market.

Responsibilities

  • Define and own mixed-signal architecture for critical HBM and DRAM subsystems, including high-speed I/O and PHY circuits, clocking and timing distribution, analog front ends, voltage regulation, sensing, and reference generation.
  • Drive architectural tradeoffs involving performance, bandwidth, latency, power, area, reliability, and scalability across HBM and DRAM product families.
  • Ensure robust reset and power-up behavior, corner-case handling, and clean ECO pathways.
  • Lead the design of advanced mixed-signal and analog circuits, including serializers/deserializers and drivers, sense amplifiers and data sampling circuits, clock/data recovery and training circuits, and power management and on-die regulation.
  • Lead pre-silicon validation strategy and review modeling assumptions.
  • Drive post-silicon bring-up, characterization, and debug.
  • Ensure designs meet HBM/DRAM specifications and compliance requirements, reliability and aging targets, functional safety targets, and EM/IR, noise, and variation tolerance requirements.
  • Guide verification strategy for mixed-signal blocks, including AMS, behavioral, and silicon-correlation approaches.
  • Partner with digital design and verification, physical design and layout, packaging, SI/PI, and process technology teams.
  • Mentor senior and staff-level engineers across disciplines.
  • Establish and evolve design methodologies, modeling standards, and best practices.
  • Apply AI/ML-assisted design methodologies to improve circuit analysis, simulation efficiency, failure triage, and design optimization workflows.
  • Leverage data-driven methods and automation to identify design trends, accelerate debug, and support predictive insights across pre-silicon and post-silicon engineering activities.
  • Collaborate with cross-functional engineering teams to evaluate and integrate AI-enabled tools that enhance productivity, design quality, verification coverage, and time-to-market.

Benefits

  • Choice of medical, dental, and vision plans
  • Income-protection benefit programs for illness or injury
  • Paid family leave
  • Paid time off
  • Paid holidays
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