HBM SIPI, Principal Engineer

Micron Technology • Folsom, CA

21h • Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of the Heterogeneous Integration Group within Technology and Products, where we build High Bandwidth Memory solutions that power AI and ML platforms. Our team works at the edge of what’s possible, stacking and integrating advanced silicon technologies to deliver industry‑leading bandwidth, density, and power efficiency. We move fast, solve hard problems, and set technical direction others follow! This role sits at the center of next‑generation HBM development. As a senior SI/PI technical authority, you will shape system‑level decisions that directly impact performance, reliability, and scalability across multiple product generations. If you enjoy deep technical ownership, complex problem solving, and influencing architecture from concept to sign‑off, this role offers both challenge and impact.

Requirements

• 7 years of experience in signal integrity and power integrity modeling and analysis
• Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design
• Hands‑on experience with industry‑standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight

Nice To Haves

• 10+ years of experience in SI and PDN modeling and analysis
• Experience with 2.5D/3D advanced packaging technologies such as interposer‑based designs
• Background working with high‑bandwidth interfaces including HBM, DDR, SERDES, or UCIe
• Direct ownership of system‑level SI/PI sign‑off for production silicon
• Scripting experience with TCL and/or Python to automate SI/PI analysis flows

Responsibilities

• Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency‑ and time‑domain evaluation
• Define and drive power delivery architecture, impedance targets, and transient analysis
• Perform electromagnetic extraction and modeling across PCB, package, and interposer designs
• Establish SI/PI standards, methodologies, and sign‑off criteria for HBM system designs
• Provide clear technical direction in ambiguous or incomplete design environments

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Principal
• Education Level: No Education Listed
• Number of Employees: 5,001-10,000 employees