Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's HBM organization is at the forefront of enabling next-generation AI, HPC, and data-centric computing — building industry-leading solutions that push the boundaries of bandwidth, power efficiency, and reliability through advanced 3D-stacked memory architectures. Our engineers work across the full product lifecycle, from early architecture definition and circuit innovation through physical build, silicon validation, and high-volume manufacturing, in a highly multi-functional environment partnering with technology development, process integration, packaging, and test teams. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal SoC DFT Engineer within the Heterogeneous Integration Group (HIG), you will be responsible for the DFT architecture, implementation, and signoff of complex HBM base-die System-on-Chip (SoC) designs. This role is part of the SoC execution team, working closely with RTL design, verification, physical design, and product engineering to ensure robust, scalable, and manufacturable test solutions from pre-silicon development through tapeout and product bring-up.
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Job Type
Full-time
Career Level
Principal
Number of Employees
5,001-10,000 employees