Jariet Technologies, Inc., a subsidiary of CesiumAstro, is developing CMOS-based digital communications technologies for micro- and millimeter-wave applications. The company is seeking a Principal ASIC Design Engineer to serve as Chip Lead for next-generation high-speed mixed-signal and DSP projects. The role calls for cradle-to-grave experience across large, high-speed communications chip design, from concept and architecture through silicon bring-up, release, and volume production. The successful candidate will lead chip design activities spanning system simulation, RTL implementation and verification, synthesis, and coordination with backend teams. The position also involves high-speed analog block integration, analysis of specifications to identify architectural and microarchitectural improvements, program and people management, project tracking, and communication with customers and marketing or sales teams. U.S. government space technology export regulations require applicants to be a U.S. citizen, lawful permanent resident, conditional resident, asylee, refugee, or otherwise eligible to obtain the required authorizations.
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Job Type
Full-time
Career Level
Principal