Principal Advanced Packaging Design Engineer

Marvell Technology•Burlington, VT

About The Position

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal, and system requirements of next-generation High-Performance Computing (HPC), Artificial Intelligence (AI), and networking solutions. The team focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability. This work involves high-speed signaling and complex power delivery networks (PDNs) that require innovative and customized solutions to meet constantly evolving customer needs. Many of these new designs require multi-chip, multi-component configurations, including but not limited to 2.5D and 3D packages, co-packaged copper or optical solutions, and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customers' most challenging design and integration problems through industry-leading packaging technologies.

Requirements

Extensive experience in substrate and/or board design for advanced packaging technologies.
Solid understanding of design-for-manufacturing (DFM) and reliability principles, as well as electrical performance considerations, with the ability to make appropriate trade-off decisions.
Proven ability to lead complex package architecture development projects involving relevant internal stakeholders, external partners, and customers.
Expertise in industry-standard tools and workflows, including Cadence 3DIC, ISP, APD, and SiP.
Bachelor's degree in Electrical Engineering or a related field with 15+ years of relevant professional experience; Master's degree with 12+ years of relevant professional experience; or Ph.D. with 8+ years of relevant professional experience.
Innovative thinking and a fundamental understanding of design rules, breakout, placement and routing, signal shielding, reference planes, power distribution, and pinout development while considering overall package and system requirements.
Experience with current-generation HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIe, Ethernet, and related technologies.
Strong understanding of signal and power integrity across substrate, board, package, and system levels.
Distinct examples of leading package design for manufacturing and reliability, including thermal-mechanical development vehicle design and testing.
Understanding of advanced 2.5D and 3D packaging technologies, including: CoWoS-S/R/L EMIB CPO CPC
Familiarity with tools and workflows such as Cadence Sigrity, Clarity, Innovus, Virtuoso, Ansys, AutoCAD, and SolidWorks.
Experience contributing to tool, process, and workflow development, as well as library maintenance.
Experience collaborating with chip design and electrical simulation teams to optimize designs.
Ability to manage programs involving cross-functional teams.
Strong interpersonal skills, a willingness to learn, and the ability to work effectively with stakeholders across multiple global time zones are essential.
Strong communication, presentation, and documentation skills.

Nice To Haves

Familiarity with running and interpreting signal and power integrity simulations is a plus.

Responsibilities

Lead small project teams of design and simulation engineers to deliver innovative, high-quality packaging solutions.
Drive package definition and architecture development for performance-line products and/or thermal-mechanical development vehicles utilizing cutting-edge packaging technologies.
Interface with package suppliers to select appropriate packaging technologies and ensure manufacturability, while meeting performance, reliability, and cost requirements.