Intel is hiring an ORAP Module Equipment Technician for its Wafer Packaging Manufacturing organization within the Planar Group in Hillsboro, Oregon. The role supports advanced packaging and semiconductor production by performing technical maintenance, operations, and equipment recovery in a cleanroom. The technician troubleshoots electromechanical systems, performs preventative maintenance, and works with engineering teams to support factory ramp priorities while maintaining safety, quality, yield, and output goals. The role works Shift 4, from 7:00 p.m. to 7:30 a.m., on an alternating weekly schedule of Sunday through Tuesday and alternating Saturday nights. It requires on-site presence and is not eligible for Intel immigration sponsorship. Candidates must meet at least one of these minimum qualifications: a high school diploma and at least four months of direct hands-on experience in semiconductor manufacturing, equipment maintenance, or a related field; or an Associate of Science degree in a STEM-related field with no prior professional experience. Preferred qualifications include at least one year of experience with electromechanical systems, interpreting mechanical drawings or electrical schematics, or semiconductor manufacturing environments or equipment. Intel describes its total compensation package as including competitive pay, stock bonuses, and health, retirement, and vacation benefits. The posted annual salary range is $44,230–$85,340 USD for this hourly role, with pay determined by location and job-related factors.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED