Intel is seeking a Module Equipment Technician to join its Wafer Packaging Manufacturing organization in Hillsboro, Oregon. The role maintains and optimizes critical semiconductor manufacturing and wafer packaging equipment to support quality and production targets. The technician performs electrical and mechanical troubleshooting, repairs, preventative maintenance, and tool calibrations, and collaborates with Module Engineering on experiments, equipment configuration changes, and cleanroom data collection. The position also supports factory ramp efforts and ongoing equipment reliability improvements. This is an on-site night-shift position. Shift 6 runs from 7:00 PM to 7:30 AM on an alternating weekly schedule of Wednesday through Saturday, with an alternating Saturday night. The role is an entry point into semiconductor equipment engineering, with hands-on learning alongside technical experts. Intel states that this position is not eligible for immigration sponsorship.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Associate degree