Module Equipment Technician, Night Shift 6

Intel•Hillsboro, OR
•Onsite

About The Position

Intel is seeking a Module Equipment Technician to join its Wafer Packaging Manufacturing organization in Hillsboro, Oregon. The role maintains and optimizes critical semiconductor manufacturing and wafer packaging equipment to support quality and production targets. The technician performs electrical and mechanical troubleshooting, repairs, preventative maintenance, and tool calibrations, and collaborates with Module Engineering on experiments, equipment configuration changes, and cleanroom data collection. The position also supports factory ramp efforts and ongoing equipment reliability improvements. This is an on-site night-shift position. Shift 6 runs from 7:00 PM to 7:30 AM on an alternating weekly schedule of Wednesday through Saturday, with an alternating Saturday night. The role is an entry point into semiconductor equipment engineering, with hands-on learning alongside technical experts. Intel states that this position is not eligible for immigration sponsorship.

Requirements

  • Meet at least one minimum qualification: an Associate of Science degree in a STEM-related field; or a high school diploma or GED plus one or more years of related equipment maintenance or troubleshooting experience; or a high school diploma or GED plus two or more years of related high-tech hands-on or military technical experience; or a high school diploma or GED plus a completed technical certification.
  • Strong problem-solving and analytical skills to diagnose complex electrical and mechanical issues.
  • Collaborative approach and ability to contribute to a high-performing shift team.
  • Attention to detail when executing tasks to specifications, documenting work, and following cleanroom protocols.
  • Commitment to workplace safety.
  • No prior professional experience is required for applicants qualifying through the STEM associate degree pathway.

Nice To Haves

  • One or more years of experience reading and interpreting mechanical drawings, blueprints, and electrical schematics.
  • One or more years of experience using Manufacturing Execution System (MES) software.
  • One or more years of experience coordinating equipment service or repairs directly with external suppliers.
  • One or more years of experience using precision hand tools and calibration equipment.
  • One or more years of experience diagnosing and repairing electromechanical systems such as robotics, pneumatic systems, actuators, or microcontrollers.
  • One or more years of experience working in a cleanroom or under strict safety protocols.

Responsibilities

  • Troubleshoot electrical and mechanical issues in high-tech manufacturing equipment, diagnosing, isolating, and resolving faults.
  • Dismantle, adjust, repair, and reassemble semiconductor tools using layout plans, blueprints, repair manuals, and technical drawings.
  • Set up equipment and perform precision calibrations and routine preventative maintenance.
  • Partner with Module Engineering on experiments, hardware and software configuration changes, and cleanroom data collection.
  • Monitor, analyze, and document tool performance data to identify improvement opportunities.
  • Update equipment specifications and technical documentation to improve system reliability.
  • Support Wafer Packaging Manufacturing factory ramp activities, including equipment installation, configuration, and conversion according to design specifications.
  • Follow cleanroom protocols and maintain a safe, clean, and compliant working environment.
  • Work collaboratively with engineering, operations, and external suppliers.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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