Intel’s Wafer Packaging Manufacturing (WPM) organization supports advanced packaging technologies and high-quality semiconductor production. The Module Equipment Technician maintains and optimizes critical semiconductor manufacturing and wafer packaging equipment in Hillsboro, Oregon. The position involves electrical and mechanical troubleshooting, repairs, preventive maintenance, and tool calibration to support production and quality targets. It provides hands-on learning alongside technical experts and supports equipment engineering, factory ramp activities, and cleanroom operations. The role works Shift 6, from 7:00 PM to 7:30 AM, on an alternating weekly schedule of Wednesday–Saturday and alternating Saturday night. It requires an on-site presence.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Associate degree