Optical Module Layout Engineer

Supermicro•San Jose, CA

About The Position

Supermicro is seeking a highly motivated Optical Module Layout Engineer to join its Optical Engineering team. The role is responsible for the physical design and PCB layout of high-speed optical transceiver modules for AI, cloud, data center, and high-performance computing applications. The engineer will collaborate with electrical, mechanical, optical, manufacturing, and supplier engineering teams to develop next-generation 800G and 1.6T optical modules. The position involves developing layouts for optical transceiver products, optimizing component placement, implementing high-speed routing, and coordinating integration of optical and electronic components. The engineer will also maintain layout guidelines and design rules, participate in SI/PI reviews, support manufacturing and testing activities, contribute to prototype debugging and qualification, and assist with new product introduction and product lifecycle management. The role requires ensuring designs meet industry standards and customer requirements.

Requirements

Bachelor’s degree in Electrical Engineering, Electronics Engineering, Physics, Optics, or a related technical discipline.
At least 5 years of PCB layout experience in optical transceiver products.
Experience with optical module design, including QSFP28, QSFP-DD, OSFP, CFP, or coherent optical modules.
Proven experience designing multilayer PCBs with high-speed serial interfaces.
Expert knowledge of PCB layout tools such as Cadence Allegro, Altium Designer, or Mentor Xpedition.
Strong understanding of signal integrity, power integrity, electromagnetic compatibility, and high-speed digital design.
Experience routing PCIe Gen4/Gen5/Gen6, Ethernet 100G/200G/400G/800G, and PAM4 SerDes technologies.
Understanding of optical subassemblies, DSP architectures, laser drivers, TIAs, optical packaging technologies, and power modules.
Familiarity with mechanical integration constraints and manufacturing processes.

Nice To Haves

Master’s degree.
Experience with 400G, 800G, and 1.6T optical transceiver technologies.
Experience supporting AI/ML infrastructure or hyperscale data center products.
Knowledge of co-packaged optics (CPO) and linear pluggable optics (LPO).
Experience working with contract manufacturers and module assembly suppliers.

Responsibilities

Develop PCB layouts for high-speed optical transceiver products, including QSFP, QSFP-DD, OSFP, and future optical module form factors.
Optimize component placement for signal integrity, power integrity, thermal performance, manufacturability, and reliability.
Collaborate with electrical and signal integrity engineers on high-speed differential routing for 112G and 224G PAM4 channels.
Coordinate with optical, mechanical, and packaging engineers to integrate lasers, photodiodes, DSPs, TIAs, drivers, and optical engines.
Create and maintain layout guidelines, stack-up definitions, design rules, and best practices.
Conduct signal integrity and power integrity reviews using simulation tools and design analysis methodologies.
Support DFM, DFA, and DFT activities.
Participate in prototype bring-up, debugging, qualification, and root-cause analysis.
Work with PCB fabricators, assembly vendors, and component suppliers to resolve design and manufacturing issues.
Support new product introduction and product lifecycle management activities.
Ensure compliance with industry standards and customer requirements.