MTS Design Architect-Custom Layout, HBM

Micron Technology•Boise, ID

About The Position

As an HBM Design Architect-Custom Layout Lead, you will support the development of advanced analog, mixed-signal, and digital circuits, as well as full-chip integration for next-generation High Bandwidth Memory (HBM) products. The role focuses on physical design and layout, including creating optimized floorplans, driving circuit placement and routing strategies, and delivering high-quality block-level layouts using advanced process nodes. You will collaborate with architecture, circuit build, and layout teams to enable DRAM solutions focused on performance, power efficiency, and density. The role also supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.

Requirements

  • MS degree with 8 or more years of memory-related custom layout design experience, or BS degree with 12 or more years of relevant experience.
  • Expertise with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
  • Strong understanding of analog layout fundamentals, including matching, EM, latch-up, coupling, IR-drop, crosstalk, and parasitic impacts.
  • Hands-on experience developing analog and mixed-signal layouts, such as sense amplifiers, LDOs, and PLLs.
  • Strong analytical, problem-solving, and collaboration skills.
  • Experience leveraging AI to accelerate layout development.

Nice To Haves

  • Experience working on DRAM custom layout.
  • Ability to clearly communicate technical concepts to design, architecture, and verification teams.
  • Motivated contributor who excels in team-based, fast-paced engineering environments.

Responsibilities

  • Lead end-to-end layout execution of analog, mixed-signal, and custom digital blocks, as well as overall chip integration for HBM products.
  • Own full-chip technical decisions covering analog, digital, memory, ESD, and EM/IR, ensuring effective performance, power, and area (PPA).
  • Develop layouts for critical memory, analog, and mixed-signal blocks, including array layout, decoders, control logic, IOs, PLLs, ADCs, DACs, LDOs, bandgaps, reference generators, charge pumps, current mirrors, comparators, and differential amplifiers.
  • Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies.
  • Support integration of memory, logic, and analog circuits for new HBM product architectures.
  • Provide design-focused insights to improve circuit robustness, performance, and reliability.
  • Participate in reviews and resolve issues across physical build, parasitic extraction, and full-chip integration.

Benefits

  • Choice of medical, dental, and vision plans.
  • Income-protection benefit programs for illness or injury.
  • Paid family leave.
  • Paid time-off program.
  • Paid holidays.
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