Micron Technology is hiring an engineer to own next-generation HBM core-die architecture and critical DRAM circuit design. The work directly affects bandwidth, power, area, thermal efficiency, and long-term reliability across advanced 3D-stacked HBM products. The engineer will drive architecture definition, circuit feasibility, and Architecture Reference Design (ARD) development, and support the design and deployment of AI-enabled solutions that improve efficiency and decision-making.
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Job Type
Full-time
Education Level
No Education Listed