Mechanical/Thermal Principal Design Engineer

Micron Technology • Boise, ID

3d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation of work and results.

Requirements

• Bachelor’s or Master’s degree or equivalent experience in Mechanical Engineering with 7+ years of mechanical and thermal engineering experience, including 7+ years in the electronics, storage, or semiconductor industry.
• Proven track record of architecting, developing, and delivering mechanical and thermal solutions for product development and customer applications.
• Strong expertise in SolidWorks, thermal modeling, and CFD simulation tools such as ANSYS Icepak, Fluent, or similar platforms, including AI-enabled design and validation workflows.
• Hands-on experience with thermal management technologies, including heatsinks, thermal interface materials, vapor chambers, heat pipes, and liquid cooling solutions, as well as thermal and mechanical testing, validation, and failure analysis.
• Deep understanding of mechanical design principles, heat transfer, fluid dynamics, GD&T, tolerance analysis, DFM/DFA, product qualification methodologies, and demonstrated technical leadership across multi-functional teams.

Nice To Haves

• Experience with DDR, LPDDR, PCIe, HBM, memory modules, storage subsystems, and AI accelerator platforms.
• Solid understanding of JEDEC standards and data center/server hardware architectures.
• Expertise in advanced thermal and cooling technologies for AI and high-performance computing (HPC) environments.
• Familiarity with finite element analysis (FEA), mechanical reliability modeling, and product performance optimization.
• Proven ability to collaborate with global suppliers and manufacturing partners, demonstrated by a history of innovation through patents, publications, or significant technical contributions.

Responsibilities

• Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems, modules, and emerging memory technologies.
• Develop innovative cooling solutions, including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling technologies.
• Define mechanical, thermal, reliability, and manufacturability requirements to meet product performance, quality, and customer objectives.
• Perform and lead thermal CFD and mechanical FEA analyses to optimize product performance, reliability, cost, and design efficiency.
• Develop and implement validation strategies, including thermal characterization, shock and vibration testing, thermal cycling, humidity testing, DFMEA, derating analysis, and reliability assessments.
• Drive design reviews, risk assessments, root cause investigations, and corrective actions throughout the product lifecycle.
• Collaborate with electrical, package, PCB, system, manufacturing, and reliability teams to deliver optimized and manufacturable solutions while contributing to JEDEC and industry standards development.
• Mentor engineers, establish engineering guidelines, serve as the mechanical and thermal domain expert across multiple programs, and champion AI-enabled engineering workflows to enhance simulation, design optimization, validation, and productivity.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Principal