Mechanical/Hardware Engineer (Thermal)

Hewlett Packard Enterprise•Chippewa Falls, WI
•$74,000 - $170,300•Onsite

About The Position

The Mechanical/Hardware Engineer (Thermal) designs, analyzes, develops, modifies, and evaluates mechanical systems, equipment, materials, and packaging, with responsibility for addressing thermal challenges in server designs. The role develops cost-effective cooling solutions that meet thermal and acoustic goals, focusing on system-level thermal design, including fans, heatsinks, materials, chemistry, fluid flow, and control logic. Work may include concept development, mechanical design, oversight of thermal simulations using Flotherm or other software, creation of mockups with dummy heat loads, and solution validation. The role also interfaces with vendors on technical issues, and some foreign travel is necessary. The position contributes intermediate subject-matter expertise to common technical problems, provides analysis and recommendations, and works independently within an established framework with moderate supervision. It leads project teams and partners through mechanical and thermal development, provides technical leadership and guidance, and supports innovation and integration of new technologies. The role is onsite, with the expectation of primarily working from an HPE office.

Requirements

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 2–4 years of experience.
  • Experience using ProEngineer or other 3D CAD software as a mechanical design tool.
  • Ability to apply analytical and problem-solving skills.
  • Experience designing sheet metal and plastic parts and associated production tooling and processes.
  • Ability to use CFD and thermal mockups to validate thermal solutions.
  • Strong written and verbal communication skills; mastery of English and the local language.
  • Ability to communicate design proposals effectively and negotiate options.
  • Strong understanding of and experience in electronics packaging.
  • Ability to learn risk management skills, including understanding and qualitatively assessing risk and using techniques to measure subcontractor and vendor performance.
  • Excitement about technology and willingness to learn new tasks and technologies.

Responsibilities

  • Lead multiple project teams of mechanical hardware engineers and internal and outsourced development partners through all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling, and testing.
  • Manage and expand relationships with internal and outsourced development partners on mechanical and thermal design and development.
  • Review and evaluate designs and project activities for compliance with technology and development guidelines and standards, and provide feedback to improve product quality.
  • Provide domain-specific expertise and mechanical/thermal leadership to cross-organization projects, programs, and activities.
  • Drive innovation and integration of new technologies into mechanical and thermal design projects and activities.
  • Provide guidance and mentoring to less-experienced staff members.
  • Communicate effectively verbally, in writing, and graphically; work independently and as part of a team.
  • Develop and validate cost-effective thermal and acoustic cooling solutions for server designs, including concept work, mechanical design, thermal simulation oversight, mockups, and solution validation.
  • Interface with vendors on technical issues.
  • Travel internationally as necessary.

Benefits

  • Health and wellbeing benefits supporting physical, financial, and emotional wellbeing.
  • Personal and professional development programs.
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