Mechanical/Hardware Engineer (Thermal)

Hewlett Packard Enterprise•Chippewa Falls, WI
•$95,800 - $220,500•Onsite

About The Position

Hewlett Packard Enterprise is seeking a Mechanical/Hardware Engineer (Thermal) to develop cost-effective cooling solutions for server designs that deliver strong thermal and acoustic performance. The role focuses on system-level thermal design, including fan and heatsink technology, materials science, chemistry, fluid flow, and system-level control logic. Work includes concept development, mechanical design, oversight of thermal simulations, creation of mockups using dummy heat loads, and solution validation. The engineer also interfaces with vendors on technical issues, and some foreign travel is necessary. The position applies subject-matter expertise to solve technical problems, recommend alternatives, and may lead projects while assisting less-experienced professionals. The engineer leads multiple project teams and development partners through mechanical and thermal design, validation, tooling, and testing for complex products and platforms. The role is onsite, with an expectation of primarily working from an HPE office.

Requirements

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 4–6 years of experience.
  • Proficiency with ProEngineer, Solidworks, or other 3D CAD software as a mechanical design tool.
  • Strong analytical and problem-solving skills.
  • Strong understanding and experience in electronics packaging.
  • Experience designing sheet metal and plastic parts and associated production tooling and processes.
  • Experience using CFD and thermal mockups to validate thermal solutions.
  • Excellent written and verbal communication skills; mastery in English and the local language.
  • Ability to communicate product architectures and design proposals and negotiate options at management levels.
  • Ability to work independently and as part of a team.

Nice To Haves

  • Interest in technology and a desire to learn new tasks and technologies.
  • Ability to learn risk management skills, including understanding and qualitatively assessing risk and using techniques to measure subcontractor and vendor performance.

Responsibilities

  • Lead multiple project teams of mechanical hardware engineers and internal and outsourced development partners through all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling, and testing.
  • Manage and expand relationships with internal and outsourced development partners on mechanical and thermal design and development.
  • Review and evaluate designs and project activities for compliance with technology and development guidelines and standards, providing feedback to improve product quality.
  • Provide domain-specific expertise and mechanical/thermal leadership to cross-organization projects, programs, and activities.
  • Drive innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.
  • Provide guidance and mentoring to less-experienced staff members.
  • Communicate effectively verbally, in writing, and graphically.
  • Interface with vendors on technical issues.
  • Develop concepts and mechanical designs, oversee thermal simulations, create thermal mockups using dummy heat loads, and validate cooling solutions.

Benefits

  • Comprehensive benefits supporting physical, financial, and emotional wellbeing for team members and their loved ones.
  • Career development programs to support professional goals and growth.
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