Mechanical/Hardware Engineer (Thermal)

Hewlett Packard Enterprise•Chippewa Falls, WI
•Onsite

About The Position

The Mechanical/Hardware Engineer (Thermal) designs, analyzes, develops, modifies, and evaluates materials, mechanical systems, equipment, and packaging. The role addresses thermal challenges in server designs by developing cost-effective cooling solutions that perform well thermally and acoustically. It focuses on system-level thermal design involving fan and heatsink technology, materials science, chemistry, fluid flow, and system-level control logic. The work includes initial concept development, mechanical design, oversight of thermal simulations using Flotherm or other software, creation of mockups using dummy heat loads, and solution validation. The engineer interfaces with vendors on technical issues, leads project teams through mechanical and thermal development stages, and provides technical leadership across projects and programs. Some foreign travel is necessary. The role may serve as a project lead and provide guidance to less-experienced staff.

Requirements

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 4–6 years of experience.
  • Proficiency with ProEngineer, Solidworks, or other 3D CAD software as a mechanical design tool.
  • Strong analytical and problem-solving skills.
  • Strong understanding of and experience in electronics packaging.
  • Experience designing sheet metal and plastic parts, along with associated production tooling and processes.
  • Proficiency with CFD and thermal mockups to validate thermal solutions.
  • Excellent written and verbal communication skills; mastery in English and the local language.
  • Ability to communicate product architectures and design proposals effectively and negotiate options at management levels.
  • Some foreign travel is necessary.

Nice To Haves

  • Excitement about technology and a desire to learn new tasks and technologies.
  • Ability to learn risk management skills, including understanding and qualitatively assessing risk and using techniques to measure subcontractor and vendor performance.

Responsibilities

  • Lead multiple project teams of mechanical hardware engineers and internal and outsourced development partners through all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling, and testing.
  • Manage and expand relationships with internal and outsourced development partners on mechanical and thermal design and development.
  • Review and evaluate designs and project activities for compliance with technology and development guidelines and standards, and provide feedback to improve product quality.
  • Provide domain-specific expertise and mechanical and thermal leadership to cross-organization projects, programs, and activities.
  • Drive innovation and integration of new technologies into mechanical and thermal design projects and activities.
  • Provide guidance and mentoring to less-experienced staff members.
  • Develop and deliver cost-effective cooling solutions for server designs, balancing thermal and acoustic performance.
  • Conduct initial concept work, mechanical design, thermal simulation oversight, mockup creation, and solution validation.
  • Interface with vendors on technical issues.
  • Communicate verbally, in writing, and graphically, and work independently and as part of a team.

Benefits

  • Comprehensive benefits supporting physical, financial, and emotional wellbeing.
  • Programs and resources for personal and professional development and career goals.
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