MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks. MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates. Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure! Mechanical Design Engineer Intern Job Purpose: • Support new RF/Microwave Component and Module level product introductions from concept through production release within the Diode and MMIC Business Units. This individual will provide Micro-electronic Packaging and Mechanical design support to product and design engineers for optimum, cost-effective solutions. This individual may be required to work under direct supervision on product development projects and tasks of limited scope to deliver solutions on schedule for high volume, high mix manufacturing.
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Career Level
Intern