Mechanical Engineer I (Onsite)

RTX•Goleta, CA

19h•$62,900 - $119,700•Onsite

About The Position

Raytheon is seeking a Mechanical Engineer I to support new product development and enhancements in the Electronic Warfare Mechanical Design Hardware Section in Goleta, California. The section designs, integrates, verifies, and produces digital processor and RF receiver subsystems for airborne platforms. The role contributes to mechanical development and enhancements across a variety of programs and interfaces with other department sections, engineering disciplines, and internal program customers. Working with more senior team members, the engineer contributes to RF system designs for challenging thermal and high-vibration environments. The work involves electronics packaging and may include thermal and structural design and analysis, electrical component design, construction and failure modes, printed wiring board and circuit card assembly processes, component installation processes, metal fabrication and finishing, RF isolation mechanical design, and environmental test methods and equipment. The position is primarily onsite in Goleta, California, with occasional travel to Raytheon facilities, suppliers, or customer sites potentially required.

Requirements

Bachelor's degree in Mechanical Engineering or a Science, Technology, Engineering, or Mathematics (STEM) major by the start date.
Experience with calculus, differential equations, calculus-based physics, statics, dynamics, mechanics of materials, thermodynamics, and heat transfer.
Experience with Geometric Dimensioning and Tolerancing (GD&T) and ASME drawing and documentation standards and procedures.
Relevant experience may be obtained through on-the-job experience, research, coursework, or projects.
U.S. citizenship is required because only U.S. citizens are eligible for a security clearance.
An active and existing DoD Secret security clearance is required after day one.

Nice To Haves

Coursework and/or experience creating and documenting mechanical designs in CREO or similar modeling tools.
Experience in structural and thermal analysis using FEA modeling techniques.
Experience in Conformal Antenna Array Packaging.
Experience in electronics packaging, cabling and harness design, and printed wiring board designs and routing.

Responsibilities

Contribute to mechanical development and enhancements for supported programs.
Work with senior team members on RF system design for challenging thermal and high-vibration environments.
Perform work involving electronics packaging.
Support assignments that may involve thermal and structural design and analysis, electrical component design and failure modes, circuit card assembly and component installation processes, metal fabrication and finishing, RF isolation mechanical design, and environmental testing.