Intern - Design Engineer, HIG HBM

Micron Technology • Richardson, TX

7d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality.

Requirements

• Currently pursuing a Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects.
• Demonstrated understanding of combinational and sequential logic design concepts.
• Experience with Verilog, SystemVerilog, or VHDL through academic, research, or project work.
• Programming experience in Python, Perl, Tcl, C/C++, or similar languages, with strong analytical and problem-solving skills.

Nice To Haves

• Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
• Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage concepts.
• Familiarity with Linux/Unix environments, scripting, and automation techniques.
• Exposure to semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar platforms.
• Previous academic, research, or internship experience related to VLSI, ASIC, FPGA, semiconductor design, or Applying AI to engineering workflows and analysis.

Responsibilities

• Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools.
• Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities.
• Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality.
• Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliverables.
• Document technical work, experimental results, AI-Enabled insights, and design methodologies to support knowledge sharing and continuous improvement.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Intern
• Education Level: No Education Listed