Intern - Design Engineer, HIG HBM

Micron • Richardson, TX

6d

About The Position

The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality.

Requirements

• Currently pursuing a Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects.
• Demonstrated understanding of combinational and sequential logic design concepts.
• Experience with Verilog, SystemVerilog, or VHDL through academic, research, or project work.
• Programming experience in Python, Perl, Tcl, C/C++, or similar languages, with strong analytical and problem-solving skills.

Nice To Haves

• Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
• Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage concepts.
• Familiarity with Linux/Unix environments, scripting, and automation techniques.
• Exposure to semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar platforms.
• Previous academic, research, or internship experience related to VLSI, ASIC, FPGA, semiconductor design, or Applying AI to engineering workflows and analysis.

Responsibilities

• Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools.
• Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities.
• Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality.
• Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliverables.
• Document technical work, experimental results, AI-Enabled insights, and design methodologies to support knowledge sharing and continuous improvement.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Intern
• Education Level: No Education Listed