Intern - Design Engineer, HBM

Micron • Richardson, TX

7d

About The Position

Micron Technology's DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle.

Requirements

• Pursuing a Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
• Working knowledge of CMOS circuit design fundamentals and semiconductor device physics.
• Experience with schematic entry and circuit simulation tools such as FineSim and/or HSPICE.
• Familiarity with Verilog modeling, simulation environments, power network analysis, and state machine logic.
• Experience with scripting languages such as Python, TCL, or Perl and strong analytical problem-solving skills.

Nice To Haves

• Knowledge of DRAM architecture, memory design concepts, and SoC/IO interfaces.
• Experience communicating complex technical concepts effectively through verbal and written presentations.
• Proven ability to work successfully in a collaborative, fast-paced engineering environment.
• Demonstrated initiative, strong teamwork skills, and a proactive approach to technical problem solving.
• Experience using AI Agents, Generative AI, or other AI-Assisted engineering productivity tools to support design, analysis, and workflow optimization.

Responsibilities

• Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities.
• Perform circuit verification, parasitic modeling, and design simulations using industry-standard tools to ensure performance and reliability targets are achieved.
• Collaborate with layout, CAD, modeling, verification, and multi-functional engineering teams to meet floor planning, routing, manufacturability, and quality objectives.
• Partner with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing teams to support product development and successful production ramps.
• Leverage AI-Assisted tools and AI-Enabled workflows to improve design efficiency, accelerate analysis, and support data-driven engineering decisions.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Intern