IC packaging layout manager

Marvell Technology•Santa Clara, CA
•$149,340 - $223,700

About The Position

The IC Packaging Layout Manager will manage a team responsible for IC package layout for high-speed 2D and 2.5D packages across multiple product lines. The role includes developing the team’s ability to produce layouts that account for manufacturing and assembly tolerances. The package engineering team supports package development from concept through mass production, with a focus on New Product Introduction (NPI), engineering samples, and production ramp-up.

Requirements

  • Bachelor’s degree in computer science, electrical engineering, or a related field, and 8+ years of related professional experience; alternatively, a master’s degree and/or PhD in computer science, electrical engineering, or related fields with 8–10 years of experience.
  • Experience managing high-performance technical teams.
  • Strong expertise with IC package layout tools such as Cadence APD or Mentor XPD.
  • Experience with 2.5D package design for IC packaging technologies such as CoWoS.
  • Experience with IC package layout for high-speed SerDes interfaces, such as 224 Gbps.
  • Experience with IC package layout for die-to-die and HBM interfaces in 2D and 2.5D RDL interposers.
  • Proven track record of new product introduction, from concept through development and production.
  • Understanding of IC package design requirements for high-speed interfaces, including setting up the constraint manager.
  • Ability to automate layout tasks using scripting and AI methodologies.
  • Strong understanding of the Design for Manufacturing (DFM) process.
  • Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.
  • Experience with power plane design and translating power supply requirements into design.
  • Strong communication, presentation, and documentation skills.

Responsibilities

  • Manage the team performing IC package layout for high-speed 2D and 2.5D packages across multiple product lines.
  • Develop the team’s capabilities in IC package layout, considering manufacturing and assembly tolerances.
  • Manage resources for IC package layouts across multiple product lines.
  • Support new product introduction from concept through development and production.
  • Look after the well-being of the team and ensure it performs efficiently.
  • Work with external IC package layout vendors.

Benefits

  • Eligible to participate in Marvell’s bonus and equity plans, including a new hire equity grant and annual equity refreshers.
  • Employee stock purchase plan with a 2-year look back.
  • Family support programs.
  • Mental health resources.
  • Recognition and service awards.
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