The IC Packaging Layout Manager will manage a team responsible for IC package layout for high-speed 2D and 2.5D packages across multiple product lines. The role includes developing the team’s ability to produce layouts that account for manufacturing and assembly tolerances. The package engineering team supports package development from concept through mass production, with a focus on New Product Introduction (NPI), engineering samples, and production ramp-up.
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Job Type
Full-time
Career Level
Manager