IC packaging layout manager
About The Position
The IC Packaging Layout Manager will manage a team responsible for IC package layout for high-speed 2D and 2.5D packages across multiple product lines. The manager will develop the team’s capability to produce IC package layouts that account for manufacturing and assembly tolerances. The role is part of Marvell’s package engineering team, which drives semiconductor package development from concept through mass production, with a focus on New Product Introduction (NPI). NPI refines a package concept into a final design, delivers engineering samples, and supports the subsequent production ramp-up. The team works on new projects and emerging technologies.
Requirements
- Bachelor’s degree in computer science, electrical engineering, or a related field and 8+ years of related professional experience; alternatively, a master’s degree and/or PhD in computer science, electrical engineering, or related fields with 8–10 years of experience.
- Experience managing high-performance technical teams.
- Strong expertise with IC package layout tools such as Cadence APD or Mentor XPD.
- Experience with 2.5D package design for IC packaging technologies such as CoWOS.
- Experience with IC package layout for high-speed SerDes interfaces, such as 224 Gbps.
- Experience with IC package layout for die-to-die and HBM interfaces in 2D and 2.5D RDL interposers.
- Proven track record of new product introduction from concept through development and production.
- Understand IC package design requirements for high-speed interfaces, including setting up the constraint manager.
- Ability to automate layout tasks using scripting and AI methodologies.
- Strong understanding of the Design for Manufacturing (DFM) process.
- Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.
- Experience with power plane design and translating power supply requirements into design.
- Experience working with external IC package layout vendors.
- Strong communication, presentation, and documentation skills.
Responsibilities
- Manage the team responsible for IC package layout across multiple product lines.
- Develop the team’s capability to create layouts that account for manufacturing and assembly tolerances.
- Manage resources for IC package layouts across multiple product lines.
- Support new product introduction from concept through development and production.
- Ensure the team is well-supported and performs efficiently.
- Work with external IC package layout vendors.
Benefits
- Eligible to participate in bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
- Employee stock purchase plan with a 2-year look back.
- Family support programs.
- Mental health resources.
- Recognition and service awards.
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What This Job Offers
Job Type
Full-time
Career Level
Manager
