IC Package Integration Lead

Apple

3d

About The Position

Apple is seeking a hardworking and passionate IC Packaging Engineering Lead to lead package integration and architecture efforts. The role works with cross-functional teams, third parties, and OSAT partners to develop packaging solutions and specifications, taking innovative concepts through package, module, and technology development to mass production and high-volume manufacturing. The position may involve travel of 5–10%.

Requirements

• Bachelor of Science degree.
• 10 or more years of relevant industry experience.
• Experience in semiconductor packaging design, process development, and technology development.
• Strong understanding of cross-functional packaging areas, including silicon floor planning, package layout and architecture, enabling process technologies, thermal and mechanical considerations, signal and power integrity, materials, component- and system-level reliability, testing, and failure analysis.
• Knowledge of advanced packaging technologies and the ability to deliver high-density, high-performance interconnects within form-factor, thermomechanical, reliability, and cost constraints.
• Excellent problem-solving skills grounded in strong physics and fundamentals.
• Excellent communication skills and ability to work effectively with internal cross-functional teams and overseas suppliers.
• Ability to work across package layout using Cadence APD/Allegro, critical signal integrity and power integrity, thermal considerations, design rules, bills of materials, design for manufacturing, reliability, and cost.
• Ability to work independently and take on projects with minimal supervision.
• Ability to lead and manage teams.

Nice To Haves

• People-management skills are highly desirable.
• Background and knowledge in Cellular, Connectivity, or PMU packaging.

Responsibilities

• Lead package integration and architecture efforts with cross-functional teams.
• Work with third parties and OSAT partners to take packaging solutions from concept to high-volume manufacturing.
• Help drive the industry through advanced packaging solutions and specifications.
• Bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
• Lead and manage teams, as applicable.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior