Engineering Assistant IV - Wire Bonding 2nd Shift

BAE Systems•Nashua, NH

1d•Onsite

About The Position

This 2nd shift team member will work directly with operators to provide on the manufacturing floor support and training for wire bonding operators. This process engineering team member will coordinate with the various functions to help support front line issues while driving continuous improvement activity under the guidance of process engineers while still performing directly labor on manufacturing builds. This position will have appropriate mentorship from process engineers to help establish confidence, leadership and ownership in the individual to help support a long term job and career growth. In addition to wire bonding this team member will support our "PMR" (preliminary material review) cell and make use of our quality systems, our manufacturing execution system, MIL STD 883 requirements along with internal documentation, as well as our internal failure analysis lab as needed. Interaction with operators will be critical to understand day-to-day problems and helping to plan out paths to resolution. Interaction with suppliers and effective communication of material problems will help shift problems back to the points of origin. This process engineering assistant job will effectively support a team of 10-15 manufacturing employees and will be empowered to help with various decisions that improve the overall success of the microelectronics factory (yield improvements, cost take out, delivery improvements). This person will work to train new operators on how to manufacturing quality product in the bonding cell, and have insight to engineering trials early on in the development process.

Requirements

Technical Associates or Bachelors degree, OR Experience within the industry of 2 years minimum with wire bonding.
Effective communication (cross shift, written/Powerpoint, and at various levels of audiences)

Nice To Haves

Experience with a palomar 8000 or 8100 wire bonder
Experience in training manufacturing employees
MIL STD 883 knowledge preferred
Secret Clearance preferred, not required

Responsibilities

Provide on the manufacturing floor support and training for wire bonding operators.
Coordinate with various functions to help support front line issues.
Drive continuous improvement activity under the guidance of process engineers.
Perform directly labor on manufacturing builds.
Support the "PMR" (preliminary material review) cell.
Make use of quality systems, manufacturing execution system, MIL STD 883 requirements, internal documentation, and the internal failure analysis lab.
Interact with operators to understand day-to-day problems and help plan paths to resolution.
Interact with suppliers and effectively communicate material problems.
Support a team of 10-15 manufacturing employees.
Help with various decisions that improve the overall success of the microelectronics factory (yield improvements, cost take out, delivery improvements).
Train new operators on how to manufacture quality product in the bonding cell.
Have insight to engineering trials early on in the development process.