Teledyne Technologies Incorporated provides advanced technology for industrial growth markets. Teledyne Imaging Sensors, a world leader in infrared sensors for space with clients like NASA, ESA, and the US Department of Defense, is seeking a Detector Test Wire Bonding Technician. This role involves executing work orders in the Manufacturing Execution System (MES), performing visual inspections of detector test chips, solvent cleaning, and mounting these chips onto LCC packages. The technician will use a manual wire bonder to connect detector test chip pads to LCC pads according to diagrams. Collaboration with detector test technicians, engineers, and manufacturing teams is crucial for resolving wire bond diagram and die selection issues. The position also requires crosstraining to support various detector test operations, including cryogenic dewar loading/unloading, IV testing, and optical testing.
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Job Type
Full-time
Career Level
Mid Level
Education Level
Associate degree