Detector Test Wire Bonding Technician

Teledyne Technologies IncorporatedCamarillo, CA
Onsite

About The Position

Teledyne Technologies Incorporated provides advanced technology for industrial growth markets. Teledyne Imaging Sensors, a world leader in infrared sensors for space with clients like NASA, ESA, and the US Department of Defense, is seeking a Detector Test Wire Bonding Technician. This role involves executing work orders in the Manufacturing Execution System (MES), performing visual inspections of detector test chips, solvent cleaning, and mounting these chips onto LCC packages. The technician will use a manual wire bonder to connect detector test chip pads to LCC pads according to diagrams. Collaboration with detector test technicians, engineers, and manufacturing teams is crucial for resolving wire bond diagram and die selection issues. The position also requires crosstraining to support various detector test operations, including cryogenic dewar loading/unloading, IV testing, and optical testing.

Requirements

  • Hands-on experience in a manufacturing, lab, or cleanroom environment
  • Ability to perform detailed work under a microscope with strong attention to quality and precision
  • Experience following written work instructions, diagrams, and process documentation
  • Comfortable working with solvents, small tools, and delicate components
  • Strong communication skills and a collaborative, team-oriented mindset
  • Willingness to crosstrain and support related test and manufacturing activities
  • HS Diploma with 5 years of experience or Associate's degree with 3 years of experience
  • US citizenship due to access restrictions

Nice To Haves

  • Semiconductor or microelectronics experience

Responsibilities

  • Execute work orders in the Manufacturing Execution System (MES), following detailed instructions to complete detector test chip mounting and wire bonding
  • Perform visual inspection of detector test chips using microscopes to identify defects, chips, or cracks
  • Solvent clean and temporarily mount detector test chips onto LCC packages
  • Use a manual wire bonder to connect detector test chip pads to LCC pads according to wire bond diagrams
  • Partner closely with detector test technicians, engineers, and manufacturing teams to resolve wire bond diagram and die selection issues
  • Crosstrain to support detector test operations, including cryogenic dewar loading/unloading, IV testing, and optical testing

Benefits

  • Competitive Salary & Benefits Package
  • Health, Dental, Vision, and Life Insurance from Day 1
  • Paid Vacation, Sick Time, and Holidays
  • 401(k) with Company Match
  • Employee Stock Purchase Plan
  • Educational Tuition Reimbursement
  • Fun Employee Events throughout the year
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