Automatic/Manual Wire Bonding Operator

MACOM Technology Solutions Holdings, Inc.•Lowell, MA

1d•Onsite

About The Position

This role will be an assembly operator working with Automatic/Manual wire bonding. MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. In addition, MACOM offers foundry services that represent a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Requirements

Ability to set-up, operate and adjust (H+K 820 systems or F&K Delvotec) or ability to learn to run a variety of microelectronic production equipment.
Minimum of 2 years' experience in microelectronics module assembly area.
High School diploma required.
Gold wire/ribbon bonding to a variety of die and substrates.
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Nice To Haves

Capable of programming equipment helpful
Capable of threading wire

Responsibilities

Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
Operate and set-up Automatic Gold wire/ribbon bonders (H+K 820 systems or F&K Delvotec) per micro-circuit layout drawings
Operator is responsible for proper wire formation, bond appearance and bond strength.
Flexibility to be trained in multiple Microelectronics processes that involve Ribbon, ball & wedge wire bonding
Capable of performing bond pull/die shear and plotting SPC with data
Familiarity of the use of plasma cleaning and other surface preparation for semiconductors and substrates
Requires significant attention to detail for production activities and documentation to maintain compliance with MIL-STD 883 requirements
Familiarity with FOD prevention and management
Familiar with ESD controls