Detector Test Wire Bonding Technician

Teledyne Technologies•Camarillo, CA

1d•Onsite

About The Position

Join Teledyne Imaging Sensors as a Detector Test Wire Bonding Technician! Are you ready to launch your career to the next level? Join our mission-focused team, where we value technical excellence, collaboration, and agility. We’re the world’s leading provider of infrared sensors for space, with customers like NASA, ESA, and the US Department of Defense.

Requirements

Hands-on experience in a manufacturing, lab, or cleanroom environment (semiconductor or microelectronics experience preferred)
Ability to perform detailed work under a microscope with strong attention to quality and precision
Experience following written work instructions, diagrams, and process documentation
Comfortable working with solvents, small tools, and delicate components
Strong communication skills and a collaborative, team‑oriented mindset
Willingness to crosstrain and support related test and manufacturing activities
HS Diploma with 5 years of experience or Associate's degree with 3 years of experience.
US citizenship due to access restrictions.

Responsibilities

Execute work orders in the Manufacturing Execution System (MES), following detailed instructions to complete detector test chip mounting and wire bonding
Perform visual inspection of detector test chips using microscopes to identify defects, chips, or cracks
Solvent clean and temporarily mount detector test chips onto LCC packages
Use a manual wire bonder to connect detector test chip pads to LCC pads according to wire bond diagrams
Partner closely with detector test technicians, engineers, and manufacturing teams to resolve wire bond diagram and die selection issues
Crosstrain to support detector test operations, including cryogenic dewar loading/unloading, IV testing, and optical testing