Engineer, Analysis Engineering

Samsung Electronics•Austin, TX
•$110,598 - $130,598•Onsite

About The Position

Samsung Austin Semiconductor is hiring an Engineer, Analysis Engineering to conduct physical failure analysis (pFA) on a range of requests, including low-yield lots, baseline material, qualifications, and customer-returned samples. The engineer identifies failure causes by selecting appropriate samples and analysis techniques to deliver timely, accurate results to internal and external customers. The role supports manufacturing and engineering teams with pFA results for new process introduction and product transfer activities, and represents the Analysis Engineering department in foundry customer meetings. The engineer analyzes electrical and imaging results, determines root causes, recommends analysis approaches, and prepares high-quality failure-analysis reports. The position also develops methods to improve analytical capabilities and reduce turnaround time. This is a full-time, on-site position. Multiple openings are available.

Requirements

  • Master’s degree in Materials Science, Materials Engineering, or a related field.
  • Completion of an undergraduate-level course, research project, or internship involving monitoring and debugging test failures.
  • Completion of an undergraduate-level course, research project, or internship involving defect monitoring, characterization, and root cause analysis.
  • Completion of an undergraduate-level course, research project, or internship involving semiconductor manufacturing or fabrication processes.
  • Completion of an undergraduate-level course, research project, or internship involving material characterization tools.
  • Completion of an undergraduate-level course, research project, or internship involving lab or fab operation.
  • Completion of an undergraduate-level course, research project, or internship involving semiconductor electrical performance.
  • Completion of an undergraduate-level course, research project, or internship involving design of experiment or testing.
  • Completion of an undergraduate-level course, research project, or internship involving semiconductor chemistry.
  • Completion of an undergraduate-level course, research project, or internship involving process or yield improvement.
  • Completion of an undergraduate-level course, research project, or internship involving thin film science.
  • Completion of an undergraduate-level course, research project, or internship involving nanotechnology.
  • Completion of an undergraduate-level course, research project, or internship involving quality monitoring.

Responsibilities

  • Conduct physical failure analysis on requests involving low-yield lots, baseline material, qualifications, and customer-returned samples.
  • Select samples and analysis techniques to identify failure causes and provide fast, accurate results.
  • Support manufacturing and engineering teams with pFA results for new process introduction and product transfer activities.
  • Represent the Analysis Engineering department in foundry customer meetings and provide analysis results on time.
  • Analyze electrical and imaging results to determine root causes.
  • Recommend analysis approaches based on customer failure-mode data and internal electrical isolation results.
  • Generate and compile high-quality failure-analysis reports for internal and external customers.
  • Develop methods to improve the team's analysis capability and reduce job turnaround time.

Benefits

  • Medical, dental, and vision insurance
  • Life insurance
  • 401(k) matching with immediate vesting
  • Onsite cafés and workout facilities
  • Paid maternity and paternity leave
  • Paid time off, including two personal holidays and 10 regular holidays
  • Wellness incentives
  • Eligible full-time employees may receive MBO bonuses based on company, division, and individual performance
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