Embedded Systems Engineer, High Speed DSP

Google•Haifa, CA
•$192,000 - $278,000

About The Position

The Embedded Systems Engineer, High Speed DSP role focuses on architecting and defining low-level firmware and control loops for Google's physical-layer communications silicon. The position sits at the intersection of digital signal processing, hardware-software co-design, and real-time systems, leading development of adaptive algorithms, forward error correction (FEC), and link-telemetry frameworks. The work translates complex communications theory into reliable, real-time silicon execution and connects high-performance hardware pipelines with Google's AI infrastructure. The role contributes to Google's TPU technology and AI/ML hardware acceleration, developing custom silicon solutions for AI/ML applications. It is part of the AI and Infrastructure team, which delivers AI and infrastructure capabilities at scale for Google users, Google Cloud customers, and Googlers.

Requirements

  • Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
  • 10 years of industry experience in embedded systems/firmware, communication systems engineering, or digital signal processing (DSP) development.
  • Experience developing embedded software in C/C++ for high-speed physical-layer interfaces (PHY), digital transceivers, or communication subsystems.

Nice To Haves

  • Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
  • Expertise in Forward Error Correction (FEC) algorithms and advanced modulation schemes.
  • Track record defining firmware framework specifications, register maps, and Silicon Life-cycle Management telemetry for high-volume networking or AI silicon.
  • Background in wireless communications with deep domain knowledge of channel modeling, noise mitigation, and digital transceiver architectures.

Responsibilities

  • Define the long-term firmware roadmap and hardware-software partitioning for physical-layer interfaces, including the balance between hardware-fixed logic and programmable firmware.
  • Architect in-situ monitoring systems and firmware-driven diagnostics to track physical-layer link health, Bit Error Rate (BER) trends, and channel quality across millions of ports in real time.
  • Design, model, and implement bare-metal or RTOS firmware to control high-speed transceivers, including real-time adaptive loops, clock and data recovery (CDR), and physical-layer calibration.
  • Partner with TPU Systems, Networking Software, and High-Performance Computing (HPC) teams to integrate silicon firmware with global cluster management and collective communication frameworks.
  • Identify and de-risk hardware-software interface bottlenecks, including register maps, driver latencies, and boot-up sequencing, that affect Google's AI infrastructure.

Benefits

  • 20% bonus target
  • Equity
  • Benefits
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