Element Attach Operator I

NEOTECH•Los Angeles, CA

9d•$20 - $22•Onsite

About The Position

The Element Attach Operator I operates automatic epoxy dispensing, screen printing, and microelectronic component placement equipment in a clean-room environment to manufacture high-reliability microelectronic devices. The role involves assembling and reworking fine-pitch microelectronic components on substrates while following work instructions, ESD requirements, and other handling procedures. The operator supports multiple customer products and contributes to quality and production goals in a fast-paced team environment.

Requirements

Visual acuity and fine motor skills to work precisely with tooling under a microscope.
Ability to meet cleanroom gowning requirements, including wearing smocks, hairnets, and masks.
Intermediate English literacy, including the ability to read and write.
Ability to collaborate in a fast-paced team environment to meet quality and production goals.
Ability to support at least two customer products while maintaining quality and production standards.
Ability to work on multiple tasks using a range of procedures with low-level complexity.
Ability to follow established procedures for routine work.
Typically, little to no experience is required.
Experience using Windows operating systems, including Microsoft Office products.

Nice To Haves

High school diploma, GED, or equivalent experience preferred.
Experience working for an ISO 9000- or AS9100-accredited organization is a plus.

Responsibilities

Read and interpret assembly instructions, drawings, and work instruction processes.
Set up and operate epoxy dispensing equipment.
Set up and operate pick-and-place machines.
Complete written tests for ESD, manual die attach, and automatic die attach requirements.
Use fine-tipped tweezers, X-acto knives, vacuum pencils, dental probes, calipers, scales, and other relevant tools.
Handle fine-pitch microelectronic components, including dies, air-bridge dies, capacitors, resistors, substrates, and hybrids, as well as epoxy and cut performs used in assembly.
Open and close die waffle packs and handle air-bridge die gel packs.
Hand-apply epoxy and solder to densely populated substrate pads without disturbing epoxy on neighboring pads.
Manually place components on substrates without disturbing neighboring wet assemblies.
Rework assemblies by removing epoxy, dies, and other components from substrates, then applying fresh epoxy and installing replacement components using appropriate tools and equipment such as a hot plate.
Follow work instructions and procedures and adhere to ESD and other handling requirements.
Complete in-house training identified in the job-specific family or training plan.
Follow company 6S and continuous-improvement (kaizen) objectives.
Perform other duties as assigned.