The Assembler 3 – Datacon Auto Die Attach Operations supports semiconductor die attach production using automated Datacon equipment in accordance with documented manufacturing procedures. The role involves loading materials, monitoring automated die attach processes, verifying process outputs, and completing production documentation while complying with quality, safety, ESD, and semiconductor manufacturing standards. Work is performed under direct to moderate supervision, depending on experience level. The position does not include manual assembly, soldering, laser marking, or laser serialization.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED