Die Attach Operator Level 2
About The Position
The Die Attach Operator performs automatic and manual die bonding with various equipment to bond integrated circuit dies to substrates, lead frames, and package cavities. The position includes Level 2 duties such as mixing glass beads into epoxy according to the required ratio; attaching dies using customer-consigned epoxy; manually attaching DAP dies without epoxy and stacking dies or components; handling tiny and thin dies using a wood-stick pickup method; and manually or automatically dispensing and attaching stiffeners. Level 2 operators recall programs and profiles for Flip Chip Attach, dispensing, die attach, and reflow equipment. The job description also lists responsibilities across Levels 1, 3, and 4, including operating and setting up die attach, flip chip, dispensing, testing, inspection, and furnace equipment; following traveler instructions; identifying and reporting process deviations; and meeting quality and safety requirements. The role is based in Silicon Valley and reports to the Production Manager.
Requirements
- High school diploma or above.
- Experience with manual die attach operations, microscopes, and manual dispense equipment such as EFD.
- Experience with manual dam and fill operations and automatic equipment such as Asymtek.
- Experience with automatic die attach bonders such as Datacon and MAT6400.
- Experience with semi-automatic flip chip bonders such as SEC860.
Nice To Haves
- Six months of semiconductor assembly experience in a production environment is preferred.
- Experience in second optical inspection may be applicable.
Responsibilities
- Mix glass beads into epoxy according to the specified mix ratio.
- Attach dies using customer-consigned epoxy of high or low viscosity.
- Manually attach DAP dies without epoxy.
- Manually attach stacked dies or components.
- Use a wood stick to pick up epoxy for die attach of tiny dies less than 0.015 inches and thin dies less than 0.006 inches.
- Manually or automatically dispense and attach stiffeners to devices.
- Recall programs for the Flip Chip Attach SEC machine.
- Recall programs on old and new versions of the Asymtek dispensing machine.
- Recall programs on the MAT 6400 and Datacon equipment.
- Recall profiles for silver glass reflow on the RTC furnace and Glass Seal.
- Recall profiles for die attach reflow on the WJ furnace for hermetic and solder paste processes.
- Perform automatic and manual die bonding to bond integrated circuit dies to substrates, lead frames, and package cavities.
- Operate die attach, flip chip, dispensing, inspection, test, and furnace equipment as applicable to the listed job levels.
- Follow job traveler instructions accurately.
- Identify and report process deviations to a supervisor.
- Meet quality goals and safety requirements and follow company policies.
- Perform other duties as assigned.
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED
